Liquid crystal display

ABSTRACT

A display device includes a substrate having plural signal lines extending in one direction and arranged in parallel in a direction intersecting the one direction, terminals connected to respective ones of the signal lines, and a semiconductor chip mounted on the substrate. The semiconductor chip has plural bumps connected to corresponding terminals through an anisotropic conductive layer. The terminals include a first group of terminals arranged at an image display region side and a second group of terminals arranged at a side remote from the image display region. An area of a respective terminal of the second group is larger than an area of a respective terminal of first group.

CROSS REFERENCE TO RELATED APPLICATION

This is a continuation of U.S. application Ser. No. 10/022,259, filedDec. 20, 2001, now U.S. Pat. No. 6,678,028, the subject matter of whichis incorporated by reference herein.

The present invention relates to a liquid crystal display, and moreparticularly, to a liquid crystal display of a so-called active-matrixtype.

The liquid crystal display of the active-matrix type is provided with aplurality of gate signal lines, which extend in the X direction and arearranged in parallel in the Y direction, and a plurality of drain signallines, which extend in the Y direction and are arranged in parallel inthe X direction, on a liquid-crystal-side surface of one of twosubstrates which are arranged to face each other in an opposed mannerwhile inserting liquid crystal disposed therebetween. A region which issurrounded by two neighboring gate signal lines and two neighboringdrain signal lines defines a pixel region.

Each pixel region is provided with a switching element which is drivenby scanning signals from one-side via a gate signal line and a pixelelectrode to which video signals are supplied from one-side via a drainsignal line through the switching element.

On a liquid-crystal-side surface of the other substrate, of the pair ofsubstrates, pixel electrodes are formed which face the pixel electrodeson the one substrate in an opposed manner and constitute capacitors. Bygenerating an electric field between the pixel electrodes which arerespectively formed on the two substrates, the light transmittivity ofthe liquid crystal is controlled.

Further, on a periphery of the liquid-crystal-side surface of onesubstrate, a semiconductor integrated circuit (IC chip), whichconstitutes a scanning signal driving circuit, and a semiconductorintegrated circuit (IC chip) which constitutes a video signal drivingcircuit, are directly mounted with bump forming surfaces thereofdirected downwardly (face down) (COG: Chip On Glass). On the substrateon which the IC chips are mounted, signal lines which correspond to theIC chips are extended to positions which face respective output bumps ofthe IC chips and terminals which are connected with the output bumps areformed on the extended portions or extensions.

Recently, there has been a demand for the liquid crystal displays toexhibit an enhancement of the definition thereof. To satisfy thisrequirement, the number of pixels has been increased and the number ofgate signal lines and drain signal lines has been increasedcorrespondingly.

As bumps (particularly, output bumps) which are connected to the signallines of the semiconductor integrated circuit, there is a knownarrangement of bumps which provides for an increased number of bumps,wherein the bumps are constituted of a first group of bumps which arearranged at the signal-line side and a second group of bumps which arearranged at the side remote from the signal lines.

In a liquid crystal display of the COG type, the semiconductorintegrated circuits are fixedly secured to the substrate by way ofanisotropic conductive layers and are respectively connected tocorresponding terminals. Japanese Laid-open Patent Publication81635/2000 discloses such a technique.

However, in this case, the connection resistance between the respectivebumps which constitute the second group of bumps and the respectiveterminals connected to these respective bumps becomes larger than theconnection resistance between the respective bumps which constitute thefirst group of bumps and the respective terminals connected to thesebumps. Accordingly, in a worst case, there arises a possibility that thesecond group of bumps may suffer from a connection failure.

SUMMARY OF THE INVENTION

The present invention, which has been made in view of theabove-mentioned circumstances, is able to provide a liquid crystaldisplay which can ensure the connection between semiconductor integratedcircuits and signal lines mounted on the liquid crystal display.

A liquid crystal display according to the present invention is providedwith a plurality of signal lines which respectively have connectionterminals and a semiconductor chip which is connected to respectiveterminals of a plurality of signal lines on a liquid-crystal-sidesurface of one of two substrates which are arranged to face each otherwith liquid crystal being disposed therebetween. The semiconductor chipincludes a plurality of bumps which are respectively connected tocorresponding terminals of respective signal lines through theanisotropic conductive layer. Further, a plurality of these bumpsconstitute at least groups of bumps arranged in two rows. The bumpsinclude a first group of bumps, which are arranged at a side close to anend portion of the semiconductor chip, and a second group of bumps,which are arranged at a side remote from the end portion, wherein acontact area between the respective bumps of the second group of bumpsand the signal lines is set to be larger than a contact area between therespective bumps of the first group of bumps and the signal lines.

The liquid crystal display according to the present invention has aresistance value at the contact portion between the respective bumps ofthe second group of bumps and the signal lines which is reduced to alevel substantially equal to the resistance value at the contact portionbetween the respective bumps of the first group of bumps and the signallines.

Accordingly, it becomes possible to eliminate the phenomenon in whichthe connection resistance between the respective bumps which constitutethe second group of bumps and the signal lines which are connected tothese bumps is increased, or a connection failure occurs in the worstcase.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an overall equivalent circuit diagram of a liquid crystaldisplay according to the present invention.

FIG. 2 is a plan view of a surface of a transparent substrate on whichIC chips are mounted.

FIG. 3A is a front view of a surface on which bumps of a semiconductorintegrated circuit mounted on the liquid crystal display according tothe present invention are formed.

FIG. 3B is a partial enlarged view of area A in FIG. 3A.

FIG. 4A is a cross-sectional view taken along a line I–I of FIG. 2.

FIG. 4B is a partial enlarged view of area A in FIG. 4A.

FIG. 5A is a front view of another embodiment of the semiconductorintegrated circuit mounted on the liquid crystal display according tothe present invention showing a plan view of a surface on which bumpsare formed.

FIG. 5B is a partial enlarged view of area A in FIG. 5A.

FIG. 6 is a plan view of a surface of a transparent substrate on whichIC chips are mounted.

FIG. 7 is a cross-sectional view illustrating the movement of conductiveparticles when the IC chip is bonded to the transparent substrate underpressure.

FIG. 8 is a comparison chart of a bonding area between bumps andconnection terminals and the number of conductive particles.

FIG. 9A is a front view of a surface on which bumps of a semiconductorintegrated circuit mounted on a conventional liquid crystal display areformed.

FIG. 9B is a partial enlarged view of area A in FIG. 9A.

FIG. 10 is a reference diagram for obtaining an approximation formula ofthe distribution of the number of particles on bumps.

FIG. 11 is a perspective view, partly in cross section, which shows oneembodiment of the liquid crystal display according to the presentinvention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Preferred embodiments of a liquid crystal display according to thepresent invention will be explained in conjunction with attacheddrawings.

Embodiment 1

<<Equivalent Circuit>>

FIG. 1 is an equivalent circuit diagram showing one embodiment of aliquid crystal display according to the present invention. The drawingis a circuit diagram in which are disposed corresponding to an actualgeometric arrangement.

One transparent substrate SUB1 is arranged to face the other transparentsubstrate SUB2 in an opposed manner liquid crystal being disposedtherebetween.

On a liquid-crystal-side surface of the transparent substrate SUB1, aplurality of gate signal lines GL, which extend in the X direction andare arranged in parallel in the Y direction, and a plurality of drainsignal lines DL, which are insulated from the gate signal lines GL andextend in the Y direction and are arranged in parallel in the Xdirection, are formed. A rectangular region which is surrounded by twoneighboring gate signal lines and two neighboring drain signal linesconstitutes a pixel region. A display region AR is constituted of a massof these pixel regions.

On each pixel region, a thin film transistor TFT, which is driven byscanning signals (voltage) supplied from one-side gate signal line GL,and a pixel electrode PIX, to which video signals (voltage) are suppliedfrom one-side drain signal line DL through the thin film transistor TFT,are formed.

Further, a capacitive element Cadd is formed between the pixel electrodePIX and the other-side gate signal line GL, which is disposed close tothe above-mentioned one-side gate signal line GL. This capacitiveelement Cadd can store the video signals supplied to the pixel electrodePIX for a long time when the thin film transistor TFT is turned off.

The other transparent substrate SUB2 is provided with a counterelectrode CT (not shown in the drawing) on a liquid-crystal-side surfacethereof, wherein the counter electrode CT is provided in common for therespective pixel regions. An electric field is generated between thepixel electrodes PIX and the counter electrode CT, which is arranged toface the pixel electrodes PIX in an opposed manner with the liquidcrystal interposed therebetween. The light transmittivity of the liquidcrystal between respective electrodes is controlled in response to thiselectric field. One end of respective gate signal lines GL extend towardone side (left side in the drawing) of the transparent substrate SUB1,and terminal portions GTM are formed at extensions of the respectivegate signal lines GL. Bumps of an IC chip GDRC, which is constituted ofa vertical scanning circuit, are connected to the terminal portions GTM.

Further, one end of respective drain signal lines DL extends toward oneside (upper side in the drawing) of the transparent substrate SUB1, andterminal portions DTM are formed at extensions of the respective drainsignal lines DL. Bumps of a semiconductor integrated circuit DDRC, whichis constituted of a video signal driving circuit, are connected to theterminal portions DTM.

IC chips GDRC and DDRC, per se, are respectively directly mounted on thetransparent substrate SUB1, thus constituting a so-called COG(Chip-On-Glass) system.

Respective bumps provided at the input sides of the IC chips GDRC, DDRCare also respectively connected to terminal portions GTM2, DTM2, whichare formed on the transparent substrate SUB1. These respective terminalportions GTM2, DTM2 are connected to terminal portions GTM3, DTM3, whichare respectively arranged at a peripheral portion of the transparentsubstrate SUB1 closest to an end surface of the transparent substrateSUB1 out of peripheral portions of the transparent substrate SUB1.

The transparent substrate SUB2 is arranged to face the transparentsubstrate SUB1, such that the transparent substrate SUB2 does not coverthe area on which the semiconductor integrated circuit is mounted. Thatis, the area of the transparent substrate SUB2 is made smaller than thearea of the transparent substrate SUB1.

The transparent substrate SUB2 is fixedly secured to the transparentsubstrate SUB1 using a sealing agent SL, which is formed around theperiphery of the transparent substrate SUB2. The sealing agent SL alsohas a function of sealing the liquid crystal between the transparentsubstrates SUB1 and SUB2.

As shown in FIG. 11, the liquid crystal display having such aconstitution is covered with a frame FRM having an opening toaccommodate a display portion AR, thus constituting a liquid crystaldisplay module.

<<Constitution in the Vicinity of the Semiconductor Integrated Circuit>>

FIG. 2 is a plan view which shows a specific example of the constitutionon the surface of the transparent substrate SUB1 in the vicinity of theIC chip GDRC, which is mounted on the transparent substrate SUB1.

In FIG. 2, with respect to respective gate signal lines GL that arearranged in the Y direction, the neighboring gate signal lines GL areformed into a group. The distance between the bumps of the IC chip GDRCis set to be smaller than the distance between respective gate signallines GL in the display portion AR; and, hence, respective gate signallines GL of each group converge with each other in the vicinity of theregion on which the IC chip GDRC is mounted. The terminals GTM areformed at positions which face the respective output bumps of the ICchip GDRC.

The terminals GTM, which are connected to respective output bumps of theIC chip GDRC, are constituted of a first group of terminals and a secondgroup of terminals, which are arranged in rows.

Respective terminals GTM(1) which constitute the first group ofterminals, are positioned at an image-display-region side (also referredto as “outer row side” as will be explained later), while respectiveterminals GTM(2), which constitute the second group of terminals, arepositioned at a side remote from the image-display-region side (alsoreferred to as “inner row side” as will be explained later).

When the IC chip GDRC is mounted on the substrate, the first group ofterminals is positioned in the vicinity of the end portion of the ICchip and the second group of terminals is positioned closer to thecenter of the IC chip than the first group of terminals.

Further, each terminal GTM(2) is positioned between respective terminalsGTM(1), and respective terminals GTM, which are constituted byrespective terminals GTM(2) and respective terminals GTM(1), arearranged in a so-called staggered pattern.

Accordingly, each gate signal line GL which is connected to the terminalGTM(2) is formed such that the gale signal line GL is positioned betweenthe gate signal lines GL which are connected to the terminals GTM(1) andruns between the neighboring terminals GTM(1).

Further, respective terminals GTM(2), which constitute the second groupof terminals, have a width W2 which is larger than the width Wi of therespective terminals GTM(1), which constitute the first group ofterminals.

With respect to the terminals GTM(2), the gate signal line GL is notformed between these terminals GTM(2); and, hence, the terminals GTM(2)can have a larger width W2 than the width Wi of the terminals GTM(1).

The reason why the width W2 of the terminals GTM(2) is set to be largeis to make the area of each terminal GTM(2), which faces thecorresponding output bump of the IC chip GDRC, larger than the area ofeach terminal GTM(1) which faces the corresponding output bump of the ICchip GDRC. For example, in this embodiment, the area of each terminalGTM(1) which faces the corresponding output bump of the IC chip GDRC is2400 μm². On the other hand, the area of each terminal GTM(2) whichfaces the corresponding output bump of the IC chip GDRC is set to belarger than the area of each terminal GTM(1) which faces thecorresponding output bump of the IC chip GDRC by 2 to 5%.

FIG. 3A is a plan view which shows a bump forming surface of the IC chipGDRC, and FIG. 3B is an enlarged view of a portion A circled by a solidline in FIG. 3A.

Output bumps GBP of the IC chip GDRC are constituted of a first group ofbumps and a second group of bumps, which are arranged in rows. Therespective bumps GBP(1), which constitute a first group of bumps, arepositioned corresponding to the terminals GTM(1) of the gate signallines GL, while the respective bumps GBP(2), which constitute a secondgroup of bumps, are positioned corresponding to the terminals GTM(2) ofthe gate signal lines GL.

The first group of bumps is arranged in the vicinity of the long-side ofthe rectangular IC chip GDRC, and the second group of bumps is arrangedcloser to the center of the IC chip GDRC than the first group of bumps.In the same manner as the arrangement of the terminals GTM, each bumpGBP(2) is positioned between respective bumps GBP(1), and respectivebumps GBP, which are constituted of respective bumps GBP(2) andrespective bumps GBP(1), are arranged in a so-called staggered pattern.

A width of the bumps GBP(2) which constitute the second group of bumps,is set to be larger than the width of the bumps GBP(1), which constitutethe first group of bumps. The reason why the width of the bumps GBP(2)is set to be larger than the width of the bumps GBP(1) is to make thearea of each second bump GBP(2) which faces the terminal GTM(2) largerthan the area of each first bump GBP(1) which faces the terminal GTM(1).

In this embodiment, if it is assumed that the area of the bump GBP(1) ofthe IC chip GDRC which faces the corresponding terminal GTM(1) isdesignated So and the area of the bump GBP(2) of the IC chip GDRC whichfaces the corresponding terminal GTM(2) is designated Si, the followingformula (1) is established.1.05So>>Si>>1.02So  (1)

FIG. 4A is a cross-sectional view showing a case in which the IC chipGDRC is mounted on the transparent substrate SUB1, and it corresponds toa cross-sectional view taken along a line I—I in FIG. 2. Further, FIG.4B is an enlarged view of a portion A circled by a solid line in FIG.4A.

An anisotropic conductive film ACF is interposed between the IC chipGDRC and the transparent substrate SUB1. The anisotropic conductive filmACF is formed of a resin film RGN in which a large number of conductiveparticles PRT are scattered. In this embodiment, an anisotropic film ACFin which the conductive particles PRT are scattered at the rate of 30 kpieces/mm² is used.

By heating the anisotropic conductive film ACF and pressing the IC chipGDRC to the transparent substrate SUB1, the IC chip GDRC is fixedlysecured to the transparent substrate SUB1 and respective bumps GBP onthe IC chip GDRC and the terminals GTM on the transparent substrate SUB1are electrically connected with each other through the conductiveparticles inside of the anisotropic conductive film ACF.

When the IC chip GDRC is pressed to the transparent substrate SUB1, aflow of the conductive particles PRT is generated inside of the resinfilm RGN of the anisotropic conductive film ACF.

In this embodiment, the number of conductive particles PRT which areinterposed between each bump GBP(2) of the group of bumps at theinner-row side of the IC chip GDRC and the terminal GTM(2), which isconnected to the bump GBP(2), can be set substantially equal to thenumber of the conductive particles PRT which are interposed between eachbump GBP(1) of the group of bumps at the outer-row side of the IC chipGDRC and the terminal GTM(1), which is connected to the bump GBP(1).Accordingly, the connection resistance between the terminal GTM(2) andthe bump GBP(2) can be made substantially equal to the connectionresistance between the terminal GTM(1) and the bump GBP(1).

In the above-mentioned embodiment, the width of the bumps GBP(2) at theinner-row side, out of the output bumps GBP of the semiconductorintegrated circuit GDLC, and the terminals GTM(2) which face the bumpsGBP(2) is set to be larger than the width of the bumps GBP(1) at theouter-row side, out of the output bumps GBP of the semiconductorintegrated circuit GDLC, and the terminals GTM(1) which face the bumpsGBP(1).

FIG. 5A is a plan view showing another embodiment of the IC chip whichis mounted on the liquid crystal display according to the presentinvention, and it is a front view of a surface on which bumps areformed. FIG. 5B is a partial enlarged view of the area A in FIG. 5A.FIG. 6 is a plan view of the surface of the transparent substrate onwhich IC chips shown in FIG. 5A are mounted.

As shown in FIG. 5A, FIG. 5B and FIG. 6, the length L2 of the bumpsGBP(2) at the inner-row side and the terminals GTM(2) which face thebumps GBP(2) may be set to be larger than the length Li of the bumpsGBP(1) at the outer-row side and the terminals GTM(1) which face thebumps GBP(1).

Further, although the above-mentioned embodiment has been explained withrespect to the output bumps GBP of the IC chip GDRC and the terminalsBTM of the gate signal lines GL which are connected to the output bumpsGBP, the above-mentioned constitution is also applicable to the outputbumps of the IC chip DDRC and the terminals DTM of the drain signallines DL which are connected to the output bumps.

<<Advantageous Effect Obtained Based on Theory>>

As shown in FIG. 7, in the mounting based on the COG system, thepressure is applied from the back-surface side of the IC chip GDRC so asto push out any extra amount of resin which is present between thetransparent substrate SUB1 and the IC chip GDRC, whereby the IC chipGDRC is bonded to the substrate SUB1 under pressure, and the bumps areelectrically connected to the gate terminals.

In such a case, the reason why the conductive particles PRT are notcaptured at the inner-row side is considered to be derived from the flowof the resin at the time of bonding under pressure. That is, in thepressure-bonding process, the resin present in the vicinity of the bumpsof the inner-row side is more liable to be pushed uniformly on thesurface than it is on the bumps of the outer-row side, so that theparticles flow parallel to the surface of the transparent substrateSUB1.

However, at the side of the bumps of the outer-row, which is close tothe end surface of the chip, the flow of the particles is interrupted bythe resin which is discharged to the end surface, so that the flow speedof the particle becomes slow. As a result, compared to the resin whichenters below the bumps of the IC chip GDRC, the resin which departs fromthe position below the IC chip GDRC becomes small transitionally; and,hence, it is considered that the conductive particles which aresandwiched and remain between the bumps of the IC chip GDRC and thetransparent substrate SUB1 are increased in number at the bumps of theouter-row side.

Accordingly, as explained with reference to the above-mentionedembodiment, by increasing the bonding area of the bump GBP(2) of theinner-row side and the terminal GTM(2), the number of the conductiveparticles captured inside of the bonding region can be madesubstantially equal to the number of the conductive particles capturedinside of the bonding region of the bump GBP(1) of the outer-row sideand the terminal GTM(1).

FIG. 9A is a front view of a surface on which bumps of a semiconductorintegrated circuit mounted on a conventional liquid crystal display areformed. FIG. 9B is a partial enlarged view of the portion A in FIG. 9A.

With respect to a conventional structure in which bumps are arranged intwo rows, according to the actually measured data, the number ofparticles is different between the inner row and the outer row, and atendency is recognized in that, as a mean value, the number of capturedparticles at the outer-row side is greater than the number of capturedparticles at the inner-row side by 2 to 5%.

Further, the frequency distribution of the captured particles takes on aPoisson distribution theoretically; and, hence, assuming the mean valueof the captured particles remaining under the bump is designated by “m”,the occurrence probability of the bumps where the particles are notcaptured can be calculated by exp(−m).

As a result, assuming that the total area occupied by the inner-rowbumps and the outer-row bumps is constant, and the mean value of thecaptured particles is changed in proportion to the change of the bumparea, the ratio of the area of the inner-row bumps with respect to theouter-row bumps, where the occurrence probability of the bumps which donot capture the particles becomes lowest can be calculated using thefollowing equation (2).F=exp(−mi′)/2+exp(−mo′)/2  (2)wherein, mi′=Si/S′ mi (equation expressing the relationship between thenumber of captured particles and the area of bumps), mo′=So/S′ mo(equation expressing the relationship between the number of capturedparticles and the area of bumps), Si+So=2S (condition to make the totalarea of bumps constant), dF/dSi=0 (condition for optimizing the totalarea of bumps).

Further, S: area of bumps which is not optimized (inner-row area andouter-row are being equal), mi: mean captured number of particles PRTcaptured by inner-row bumps (actually measured data), mo: mean capturednumber of particles PRT captured by outer-row bumps (actually measureddata), Si: area of inner-row bumps which is optimized, So: area ofouter-row bumps which is optimized, mi′: mean captured number ofparticles PRT captured by inner-row bumps after optimizing area(estimated value), mo′: mean captured number of particles PRT capturedby outer-row bumps after optimizing area(estimated value), F: estimatedoccurrence rate of bumps with no particles (per one bump) while assumingthe mean number of captured particles by inner-row bumps is mi′ and themean number of captured particles by outer-row bumps is mo′.

Then, the result obtained by carrying out the equation (2) based onrespective measured data is shown in FIG. 8.

Seven kinds of specifications of the anisotropic conductive films aredescribed in FIG. 8. These anisotropic conductive films differ from eachother in the specification of the resin, the diameter of particles, andthe density of particles in the film. The total area of bumps is setconstant throughout these anisotropic conductive films.

When the area difference ((Si/So)−1) is less than 2%, the number ofcaptured particles in the inner-row bump portions is smaller than thenumber of captured particles in the outer-row bump portions; and, hence,the connection resistance of the inner-row bump portions becomes higherthan the connection resistance of the outer-row bump portions. On theother hand, when the area difference exceeds 5%, the connectionresistance of the outer-row bump portions becomes higher than theconnection resistance of the inner-row bump portions. Based on suchmeasured data, the optimal value was obtained when the area differencewas set to a range of 2 to 5%.

The approximate equation of the distribution of the number of particleson bumps can be calculated as follows.

Assuming the population mean density of particles per unit area afterpressure bonding is designated “n” (pieces/mm²) and the area of a smallregion when the unit area is divided in n parts is designated “a”, theprobability that the particles are present in the small region is “a”.Since the probability P(r) that r regions which include particles arepresent when n small regions are sampled follows the binominaldistribution, the following equation is established.P(r)=nCr×a ^(r)×(1−a)^((n−r))  (3)This equation is also applicable to a small region “b” which has thelarger area than “a”.

That is, the following equation (4) is also established.P(r)=nCr×b ^(r)×(1−b)^((n−r))  (4)

In this case, the mean value becomes nb and the dispersion σ² becomesnb(1−b).

When “n” is large or “b” is extremely small, the equation (3) can beapproximated by the Poisson distribution; and, hence, the followingequation (5) can be obtained.P(r)=(nb)^(r) ×e ^(−(nb)) /r!  (5)

Since nb is the mean number of particles in the small region, by settingnb as nb=m, the equation (5) can be approximated by the followingequation (6).P(r)=m ^(r) ×e ^(−m) /r!  (6)

In this case, the dispersion σ² becomes σ²=m and, hence, the probabilitycan be expressed with only one variable m.

As an example of application of the Poisson distribution, the number ofbacteria within a visual field of a microscope or defective productsamong products produced on a mass production basis and the like areknown.

In the above-mentioned embodiments, a liquid crystal display which isprovided with an IC chip having groups of bumps in two rows at one sidethereof has been explained. With respect to a liquid crystal displaywhich is provided with an IC chip having groups of bumps of three ormore rows at one side, the bonding area of a group of bumps which isclosest to the end portion of the IC chip is minimized and the bondingarea of the bumps is increased as the groups of bumps are moved awayfrom the end portion of the IC chip.

As can be clearly understood from the above-mentioned explanation,according to the liquid crystal display of the present invention, areliable connection between a mounted semiconductor integrated circuitand signal lines can be obtained.

1. A display device including: a substrate having plural signal linesextending in one direction and arranged in parallel in a directionintersecting the one direction; terminals connected to respective onesof the signal lines; and a semiconductor chip mounted on the substrate;wherein the semiconductor chip has plural output bumps connected tocorresponding ones of the terminals through an anisotropic conductivelayer, the output bumps include a first group of output bumps which arearranged at a side close to an end portion of the semiconductor chip anda second group of the output bumps which are arranged at a side remotefrom the end portion of the semiconductor chip; and wherein theterminals include a first group of terminals arranged at an imagedisplay region side and a second group of terminals arranged remote fromthe image display region side, the first group of terminals connect thefirst group of output bumps, and the second group of terminals connectthe second group of output bumps, an area of a respective terminal ofthe second group being larger than an area of a respective terminal ofthe first group.
 2. A display device according to claim 1, wherein theterminals of the first group and the terminals of the second group arearranged in a staggered manner.
 3. A display device according to claim1, wherein a width of the terminals of the second group is set largerthan a width of the terminals of the first group.
 4. A display deviceaccording to claim 1, wherein a length of the terminals of the secondgroup is set larger than a length of the terminals of the first group.5. A display device according to claim 1, wherein the image displayregion includes plural pixels, the pixel is surrounded by gate signallines extended in the X direction and arranged in parallel in the Ydirection and drain signal lines extended in the Y direction andarranged in parallel in the X direction, the pixel includes switchingelements which are operated in response to scanning signals fromone-side gate signal lines and pixel electrodes to which video signalare supplied from one-side drain signal lines through the switchingelements on the pixel regions, the signal lines are formed of at leastthe gate signal lines, and the semiconductor chip includes a scanningsignal driving circuit.
 6. A display device according to claim 1,wherein the image display region includes plural pixels, the pixel issurrounded by gate signal lines extended in the X direction and arrangedin parallel in the Y direction and drain signal lines extended in the Ydirection and arranged in parallel in the X direction, the pixelincludes switching elements which are operated in response to scanningsignals from one-side gate signal lines and pixel electrodes to whichvideo signal are supplied from one-side drain signal lines through theswitching elements on the pixel regions, the signal lines are formed ofat least the drain signal lines, and the semiconductor chip includes avideo signal driving circuit.
 7. A display device according to claim 1,wherein the plural signal lines to which the first and second group ofterminals are connected extend in the image display region.